Standard:
DIN EN 62435-5 VDE 0884-135-5:2017-10Electronic components – Long-term storage of electronic semiconductor devices Part 5: Die and wafer devices |
Standard:
DIN EN 62228-2 VDE 0847-28-2:2017-09Integrated circuits – EMC evaluation of transceivers Part 2: LIN transceivers |
Standard:
DIN EN 62433-4 VDE 0847-33-4:2017-05EMC IC modelling Part 4: Models of integrated circuits for RF immunity behavioural simulation – Conducted immunity modelling (ICIM-CI) |
Standard:
DIN EN 62132-1 VDE 0847-22-1:2016-09Integrated circuits – Measurement of electromagnetic immunity Part 1: General conditions and definitions |
Standard:
DIN IEC/TS 61967-3 VDE V 0847-21-3:2015-08Integrated circuits – Measurement of electromagnetic emissions Part 3: Measurement of radiated emissions – Surface scan method |
Standard:
DIN IEC/TS 62132-9 VDE V 0847-22-9:2015-08Integrated circuits – Measurement of electromagnetic immunity Part 9: Measurement of radiated immunity – Surface scan method |
Standard:
DIN EN 62215-3 VDE 0847-23-3:2014-04Integrated circuits – Measurement of impulse immunity Part 3: Non-synchronous transient injection method |
Standard:
DIN EN 62132-8 VDE 0847-22-8:2013-03Integrated circuits – Measurement of electromagnetic immunity Part 8: Measurement of radiated immunity – IC stripline method |
Standard:
DIN EN 62132-2 VDE 0847-22-2:2011-07Integrated circuits – Measurement of electromagnetic immunity Part 2: Measurement of radiated immunity – TEM cell and wideband TEM cell method |