Rubrik: Proceedings - ETG-Fachberichte
ETG-Fb. 173: CIPS 2024
größer

Power Engineering Society in the VDE (VDE ETG) (Hrsg.)

ETG-Fb. 173: CIPS 2024

13th International Conference on Integrated Power Electronics Systems, March, 12 – 14, 2024, Düsseldorf, Germany

ETG-Fachberichte

2024, 730 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-6288-0, E-Book: ISBN 978-3-8007-6289-7
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:

- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems´ and components‘ operational behaviour and reliability
Die Energietechnische Gesellschaft im VDE (VDE ETG) bündelt im VDE mit über 12.000 Mitgliedern die Fachkompetenz der Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern.
Das umfangreiche Expertenwissen der ca. 300 ehrenamtlichen Mitarbeiter aus Industrie, For-schung, Versorgungsunternehmen, Hochschulen und Behörden, die in Fachbereichen, Fachaus-schüssen und Arbeitskreisen mitwirken, bildet die technisch-wissenschaftliche Basis für ETG-Veranstaltungen und -Publikationen.
Zur erweiterten Tagungsbeitragssuche
1

Digital Twin and Virtual Release of Automotive Electronics

Autoren: Loos, Florian; Schautzgy, Johannes; Obermayr, Martin; Tauscher, Markus; Sova, Libor; Krejcova, Milada
2

Design Automation for Power Electronics: a path towards realization

Autoren: Hermanns, Kevin
3

Unlocking the Opportunities of Bidirectional GaN Devices in Isolated DC/DC Converters and Multilevel Inverters

Autoren: Barzegarkhoo, Reza; Pereira, Thiago; Liserre, Marco
4

Pairing Gate Driver Performance with ISO 26262 Functional Safety Requirements

Autoren: Hornkamp, Michael
5

Soft Magnetic Components: Functional in Practice Despite Tolerances and Calculation Inaccuracies

Autoren: Kampen, Dennis; Owzareck, Michael; Langfermann, Sascha; Fraeger, Lukas
6

The latest material technology to support power module packaging

Autoren: Makihara, Koji; Ukawa, Ken
7

Life-Cycle Carbon Footprints of Low-Voltage Motor Drives with 600-V GaN or 650-V SiC Power Transistors

Autoren: Huber, Jonas; Imperiali, Luc; Menzi, David; Kolar, Johann W.; Musil, Franz
8

Interest of high frequency decoupling inductors for reducing common mode current in high speed switching cells

Autoren: Botter, N.; Bikinga, W. F.; Avenas, Y.; Guichon, J. M.; Schanen, J. L.
9

Investigating the Effect of Voltage and Current Stress on Temperature Dependent On-State Resistance in GaN HEMT Power Devices

Autoren: Li, Tianyu; Lindemann, Andreas
10

An Improved Approach for an Intermediate Measurement Routine of Dynamic On-State Resistance for GaN Power Devices

Autoren: Goller, Maximilian; Franke, Joerg; Li, Gengqi; Mouhoubi, Samir; Curatola, Gilberto; Lutz, Josef; Basler, Thomas
11

Single Supply High Voltage Module with no Auxiliary Bootstrap Network

Autoren: Villani, Claudio; Ruzza, Stefano; Malcovati, Piero; Bonizzoni, Edoardo
12

Evaluation of a Rogowski-based di/dt sensing for temperature monitoring of SiC MOSFET in TO-247 package

Autoren: Jamois, Arthur; Morand, Julien
13

Integration of controllable inductors in hardware in the loop systems

Autoren: Maier, Herbert; Pfeiffer, Jonas; Schmidhuber, Michael
14

Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements

Autoren: Quergfelder, Simon; Sax, Julian; Heckel, Thomas; Eckardt, Bernd; Maerz, Martin
15

Evaluation of the Thermal Fatigue and Failure Mechanisms on Power Modules with Different Types of Substrates (DBC / IMS)

Autoren: Spano, Chiara; Galfré, Giulio; Mattiuzzo, Emilio; D’Ancona, Lorenzo; Bertana, Valentina; Scaltrito, Luciano; Ferrero, Sergio
16

Performance Test of a 450 V Polymer Aluminium Electrolytic Capacitor

Autoren: Ebel, Thomas; Neupane, Shova; Rassmann, Rando; Schuemann, Ulf; Hammerl, Matthias; Greif, Andreas
17

Optimized Super Cascode Circuit for Electrical Testing under High Frequencies, Voltages and Voltage Gradients

Autoren: Huether, Christian; Wels, Sebastian; Raulf, Tobias; Fehmer, Felix
18

Thermomechanical characterisation of soft potting materials and stress reduction by compressibility

Autoren: Wirries, Jonas; Ruetters, Martin
19

Nickel as Phase Growth Accelerator in Ternary Solder Systems

Autoren: Richter, Jessica; Kopczynski, Anna; Schellscheidt, Benjamin; Licht, Thomas
20

Examination of the Pore Structure of Copper Sintered Die Attach Layers by Local Thickness Analysis and Scratch Test

Autoren: Raemer, Olaf; Hutter, Matthias; Schneider-Ramelow, Martin
21

Evaluation of accuracy and performance of an optimized simulation model by measuring a manufactured test vehicle

Autoren: Papperi Devarajulu Deenadayalan, Janagan; Weis, Gerald
22

Development of High-speed Current Switch Box for Transient Thermal Characterization of SiC Power Modules

Autoren: Fukunaga, Shuhei; Funaki, Tsuyoshi
23

Fast Two-Step Sintering Process with High Strength

Autoren: Schellscheidt, Benjamin; Kopczynski, Anna; Richter, Jessica; Licht, Thomas
24

Testing of SiC MOSFETs for short over-current pulses of 1 ms

Autoren: Bhadoria, Shubhangi; Soundhariya, G. S.; Nee, Hans-Peter
25

Analytical Design of a Finite Input Inductance 34.5 MHz Class E Inverter for Wireless Power Transfer

Autoren: Beley, Matthieu; El-Khattabi, Mohamed; Pace, Loris; Breard, Arnaud
26

Systematic evaluation of DC-link capacitors for GaN applications

Autoren: Fricke, Tobias; Mallwitz, Regine
27

Exploring coupling coil integration in Power Semi-Conductor Modules environment for sensing in Railway traction

Autoren: Dumollard, Yannick; Escrouzailles, Vincent; Batista, Emmanuel; Tisne-Grimaud, Damien
28

Why the 3 dB bandwidth of a current sensor does not provide an exact statement about its measurement capability

Autoren: Lutzen, Hauke; Ziegler, Philipp; Roth-Stielow, Joerg; Kaminski, Nando
29

A high voltage DC/AC unipolar converter to drive a piezoelectric actuator with controlled response times

Autoren: Bennacer, Nassim Rayane; Martin, Christian; Pace, Loris
30

Balanced core fluxgate DC current transducers for high precision measurement up to 10 MHz

Autoren: Roland, Buerger; Birkerod Lillholm, Morten; Elbaek, Henrik
31

Voltage-Sensorless Control and GaN Multilevel Converter for Charging Non-Linear and Lossy Electrocaloric Capacitors

Autoren: Moench, Stefan; Reiner, Richard; Basler, Michael; Waltereit, Patrick; Quay, Ruediger; Bartholome, Kilian
32

Technique for Measuring the Capacitance-Voltage Characteristics of GaN and SiC Bidirectional Power Switches

Autoren: Bosch, Michael; Koch, Dominik; Nuzzo, Jeremy; Kallfass, Ingmar
33

Optimal parameters design of bidirectional buck-boost three-level DC-DC converter based on Pareto front for electrochemical energy storage

Autoren: Dou, Zechun; Tan, Bo; Le, Wentao; Qi, Yu; Chen, Yanping
34

A Systematical and Analytical Driver Layout Design Procedure for Parallel GaN GIT Power Semiconductors

Autoren: Peinsipp, Moritz; Sah, Bikash; Sprunck, Sebastian; Jung, Marco
35

Influence of VDS Bias on SiC MOSFET Dynamic Gate Stress

Autoren: Gebhardt, Mathias; Lieser, Gabriel
36

Investigation of TSEPs for junction temperature estimation of GaN and SiC devices in power cycling tests

Autoren: Woehrle, Dennis; Wattenberg, Daniel; Burger, Bruno; Ambacher, Oliver
37

Challenges of Junction Temperature Calibration of SiC MOSFETs for Power Cycling – a Dynamic Approach

Autoren: Breuer, Jakob; Dresel, Fabian; Schletz, Andreas; Klier, Johannes; Leib, Juergen; Maerz, Martin; Eckardt, Bernd
38

A Fast Source to Drain Voltage Measurement in Bridge Topologies Using a Freewheeling Path for Dynamic Power Cycling Tests

Autoren: Baron, Kevin Munoz; Swaroop Dash, Sarthak; Solomakha, Oleksandr; Kallfass, Ingmar
39

Evaluation of failure modes in film capacitors after accelerated lifetime testing compared to field returns

Autoren: Rudolph, Marco; Naumann, Falk; Muehs-Portius, Bolko; Klengel, Sandy; Knoch, Jan
40

Implementation of a Junction Temperature Cycle Recorder in a Battery Electric Vehicle and Accuracy Assessment by Road Testing

Autoren: Denk, Marco; Esau, Marvin; Fritsch, Sascha; Ubben, Ole
41

Accelerated Quality Testing for Coatings in High Voltage Applications

Autoren: Meier, Markus R.; Eckardt, Mirco; Schweigart, Helmut
42

Condition Monitoring of Power Modules for SiC and GaN Semiconductors by Piezoelectric Effect

Autoren: Bickel, Philipp; Jung, Marco; Kriegel, Kai; Donat, Albrecht; Mitic, Gerhard; Walbrecker-Baar, Christian
43

Online Junction Temperature Estimation Based on the Drain Current Rising Edge for SiC MOSFETs

Autoren: Li, Zekun; Yu, Puzhen; Ji, Bing; Cao, Wenping
44

Reliability Analyzes of Power Electronics Encapsulations using (Electrochemical) Impedance Spectroscopy – a first approach

Autoren: Gierth, P.; Gierth, U.; Schneider, M.; Rebenklau, L.; Boyke, M.; Steinacker, P.; Schweigart, H.; Meier, M. R.; Eckardt, M.; Schrems, P.
45

Reducing SMPS Size and Losses with a Novel Piezoelectric EMI Filter

Autoren: Hubert, Florian; Kuebrich, Daniel; Duerbaum, Thomas; Rupitsch, Stefan J.
46

A high-frequency performance and degradation study of adhesive conductive EMI shielding tapes during High-Temperature Storage

Autoren: Seliger, Norbert; Helmbrecht, Cordula
47

Adaptive Dead Time Control for GaN HEMTs Based on a Time- Discrete Extremum-Seeking System

Autoren: Fink, Tobias; Koch, Dominik; Kallfass, Ingmar
48

A three-phase coupled inductor for a medium voltage high power charging system

Autoren: Blaum, Christian; Wrensch, Philemon; Pfeiffer, Jonas; Drexler, Christoph; Schmidhuber, Michael; Derix, David; Hensel, Andreas
49

Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics

Autoren: Avenas, Yvan; Bruyere, Paul; Vagnon, Eric; El Khattabi, Mohamed
50

Test bench for the characterization of two-phase passive immersion cooling of power electronic devices

Autoren: Hugon, Clement; Avenas, Yvan; Flury, Sebastien; Siedel, Samuel
51

Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly

Autoren: Ferber, Moises; Bruyere, Paul; Botter, Nicolas; Can, Alejandro; Bouzerd, Souhila; Guichon, Jean-Michel; Schanen, Jean-Luc; Derbey, Alexis; Vagnon, Eric; Combettes, Celine; Bley, Vincent; Sarraute, Emmanuel; Dupont, Laurent; Avenas, Yvan
52

Accelerated Voltage Endurance Test and Insulation Lifetime Estimation of Silicone-Gel Encapsulated Direct-Bond-Copper Substrates for Medium-Voltage Power Module Packaging

Autoren: Gao, Yuan; Zhang, Zichen; Zintak, Zachary; Arriola, Emmanuel; Aunsborg, Thore Stig; Munk-Nielsen, Stig; Lu, Guo-Quan
53

Die-Level Series-Connection of SiC MOSFETs and Integration of Decoupling Capacitors

Autoren: Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis
54

A Parasitic Extraction Strategy for Four-Terminal Power Devices

Autoren: Weiser, Mathias C. J.; Kallfass, Ingmar
55

Evaluation of Different Diode Technologies in a Si-SiC Hybrid Switch Used in a 540V/30kVA Inverter

Autoren: Andrade, Marco; Cougo, Bernardo; Morais, Lenin M F; Sathler, Gustavo
56

Investigation on failure mechanisms of a PCB based package using DC active power cycling

Autoren: Perrin, Remi; Pichon, Pierre-Yves; Morand, Julien; Le Lesle, Johan; Lefevre, Guillaume
57

DC- and AC-Side EMI Filter Design for an Interleaved Three Phase/Level ANPC High-Power GaN PV Inverter Using Coupled Inductors

Autoren: Wang, Fan; Wagner, Valentin; Sprunck, Sebastian; Dick, Christian; Jung, Marco
58

GaN Power Converter with low inductive hybrid PCB Technology

Autoren: Braun, Gerrit; Wethmar, Julian; Kessler, Jan-Thorben
59

The Reliability of High Temperature Pb-Free Solder for High Power Semiconductor Device Packaging

Autoren: Mat, Maryam; Grant, Thomas; Wang, Yangang; Morshed, Muhammad
60

Novel Low Temperature Alloy for Molded Power Module Soldering to Customized Heatsinks

Autoren: Hertline, Joe; Mayberry, Ryan; Hutzler, Aaron
61

AC Filter Capacitors Reliability and Lifetime in Grid-Tied Inverters

Autoren: Nguyen, Thang; Delincé, François; Meinguet, Fabien; Hilal, Alaa; Garcia-Rojo, Ramon
62

Influence of hard encapsulation onto reliability of soldered die-attach in power modules

Autoren: Sprenger, Mario; Oeztuerk, Beyza; Forndran, Freerik; Sippel, Marcel; Ockel, Manuela; Goth, Christian; Franke, Joerg
63

Estimation of thermo-mechanical Anand model parameters of die-attach materials for power electronics assemblies

Autoren: Fuste, Nauem; Sola, Emma; Avino, Oriol; Perpina, Xavier; Vellvehi, Miquel; Jorda, Xavier
64

Anti-ferroelectric MLCCs with high energy density for DC link applications

Autoren: Gebhardt, Sylvia; Molin, Christian; Neubert, Holger
65

Design, Characterisation and Implementation of PCB Based 3-Φ Coupled Inductors for High Power Density Interleaved DC-DC Converter

Autoren: Le Lesle, Johan; Lefevre, Guillaume
66

Fabrication and characterization of low value embedded resistors for use in PCB embedded RC snubber for more integrated converter.

Autoren: Can-Ortiz, Alejandro; Bley, Vincent; Botter, Nicolas; Avenas, Yvan
67

Multidimensional Switching Loss Analysis of Various 1200 V SiC - Power MOSFET Technologies

Autoren: Schnitzler, Ruben; Dos Santos Gomes, Erine; Koch, Dominik; Rasic, Petar; Kallfass, Ingmar
68

Self-controlled driver circuit optimizing dead time in fast GaN converters

Autoren: Schwarzott, Viktiria; Kuring, Carsten; Wieczorek, Nick; Dieckerhoff, Sibylle
69

Sulphide dendrite growth in semiconductor power modules: Towards mission profile calculations of temperature, humidity, and H2S concentration dependencies

Autoren: Wassermann, Tobias N.; Schilling, Oliver
70

A Methodology to Estimate On-Voltage Degradation of Power Devices According to a Power Cycling Mission Profile

Autoren: Vaccaro, Alessandro; Magnone, Paolo
71

Mission-Profile-Related Evaluation of the Threshold-Voltage Stability of SiC MOSFETs

Autoren: Oliveira, Joao; Meuret, Regis; Coccetti, Fabio; Boldyrjew-Mast, Roman; Herrmann, Clemens; Basler, Thomas; Morel, Herve
72

Reliability Assessment of Modular Multilevel Converters: A Comparative Study of MIL and Mission Profile Methods

Autoren: Ahmadi, Miad; Kardan, Faezeh; Shekhar, Aditya; Bauer, Pavol
73

Modified Approach for the Rainflow Counting Analysis of Temperature Load Signals in Power Electronics Modules

Autoren: Letz, Sebastian A.; Zhao, Dawei; Leib, Juergen; Eckardt, Bernd; Maerz, Martin
74

Horizontal Cracks in PCB Embedded Semiconductor Devices: A Real Problem or a Ghost Hunt?

Autoren: Huesgen, Till; Bhushan Sharma, Ankit
75

Cu-Si3N4 AMB-substrates for circuit boards in power electronics

Autoren: Rost, A.; Kuczynski, M.; Zschippang, E.; Dold, P.; Hoerig, J.; Mosch, S.; dos Santos, S.; Gierth, P.; Winhauer, J.; Pfeiffer, J.; Schilm, J.; Herrmann, M.
76

The Attractions, Challenges, and Potential of Copper Sinter Paste for Power Electronics Applications

Autoren: Duch, Susanne; Gunst, Stefan; Reh, Sascha
77

Ultrasonic Rivet Welding as Signal Technology in Power-Modules

Autoren: Dreps, Florian; Zoellner, Nils; Borghoff, Georg; Guth, Karsten; Strotmann, Guido
78

Evaluating non-isolated chip-assembly with direct liquid cooling

Autoren: Schulz, Martin; Klemmer, Ralf; Kreiner, Lukas
79

Investigation of thermo-mechanical fatigue in lateral GaN power transistors with variable switching and conduction losses

Autoren: Hein, Lukas; Schwabe, Christian; Goller, Maximilian; Basler, Thomas
80

Aging of Insulation Materials under Repetitive Impulse Voltage Stress

Autoren: Claudi, Albert; Fehmer, Felix; Raulf, Tobias; Klengel, Robert
81

Energy Balancing in Paralleled SiC MOSFETs During an Avalanche Event

Autoren: Herrmann, Clemens; He, Mengdi; Alaluss, Mohamed; Basler, Thomas; Elpelt, Rudolf; Zeng, Guang
82

Characterisation of 1200 V SiC-MOSFETs - Influence of Repetitive Short-Circuit Events on Device Parameters

Autoren: Brandt, Soenke; Rasch, Martin; Wanagat, Tim; Hoffmann, Klaus F.
83

Investigation of Moisture Absorption and Drying Characteristics of HVIGBT Power Modules

Autoren: Sakai, Yasuhiro; Mikami, Kazuto; Hatori, Kenji; Nakamura, Keiichi; Oya, Daisuke; Soltau, Nils
84

Step-Change in HV-H³TRB Performance of Latest Silicon IGBTs and Advanced Humidity Testing Methods

Autoren: Peters, Jan-Hendrik; Hanf, Michael; Clausner, Sven; Kaminski, Nando
85

Automatic Generation of Thermal Models for PCB-based Power Electronics

Autoren: Hamed, Bahaeddine Ben; Ahmed, Ahmed Sabry Eltaher; Regnat, Guillaume; Perrin, Remi; Lefevre, Guillaume; Buttay, Cyril; Jay, Jaques
86

Optimizing Power Modules by Enhancing Power Density, Ease of Implementation and Supporting Automotive Reliability Requirements

Autoren: Mueller, Holger; Stallmeister, Marco; Spitzer, Dietmar
87

Thermo-mechanical and electromagnetic simulations of a Half-Bridge Insulated Prepackage for Modular Power Modules

Autoren: Frroku, Saimir; Sharma, Ankit Bhushan; Huesgen, Till; Irace, Andrea; Salvatore, Giovanni A.
88

Effect of local concavity of DBC substrate on junction-to-heatsink thermal resistance of power module designs

Autoren: Csiki, Daniel; Buza, Mate; van Dijk, Marius; Tauer, Matthias; Wittler, Olaf
89

Achieving SiC Power modules with high heat dissipation by Developing New Bonding Material

Autoren: Hayashi, Kenji; Tanikawa, Kohei; Sato, Oji; Ishibashi, Takaharu; Hayashiguchi, Masashi; Otsuka, Takuazu; Wakamoto, Keisuke; Noma, Tsuguki; Mostafa, Noah; Filsecker, Felipe
90

Surge Current Test of SiC MOSFET with Planar Assembly and Joining Technology

Autoren: Ye, Yijun; Hensler, Alexander; Botazzoli, Pietro; Bigl, Thomas; Schmidt, Ralf; Basler, Thomas; Lutz, Josef
91

Impact of VCE,sat measurement conditions on cycle-to-failure determination of IGBT samples in power cycling test

Autoren: Zhang, Yichi; Zhang, Yi; Yao, Bo; Wang, Huai
92

Influence of Current Density on Power Cycling Test of Low Voltage MOSFETs in DC Body-Diode Mode and Switching MOSFET-Mode

Autoren: Abuogo, James; Schwabe, Christian; Lutz, Josef; Basler, Thomas
93

Substantial increase of power cycling capability of SiC MOSFETs after preconditioning

Autoren: Kempiak, Carsten; Lindemann, Andreas
94

Milliseconds Power Cycling (PCmsec) driving bipolar degradation in Silicon Carbide Power Devices

Autoren: Laha, S.; Leib, J.; Maerz, M.; Schletz, A.; Liguda, C.; Faisal, F.; Momeni, D.
95

Improvement of PC ruggedness by AlN substrate in Easy power modules with Silicon Carbide technology

Autoren: Methfessel, Torsten; Zhou, Meng-Meng; Mier, Ainhoa Puyadena; Salmen, Paul
96

Impact of the Level of Negative Gate Voltage on the Temperature Measurement during Power Cycling Testing of SiC MOSFETs

Autoren: Heimler, Patrick; Reiter, Kristiane; Guenther, Marco; Lutz, Josef; Basler, Thomas
97

Recycling potential of power electronics solutions – an exemplary study about on-board chargers

Autoren: Minke, Christine; Burfeind, Paula; Mallwitz, Regine; Hu, Daiyi
98

Current Ripple Reduction Approaches in a Heavy-Duty Fuel Cell Truck

Autoren: Guerlek, Yavuz; Akerl, Martin; Pfeifer, Kristina; Dold, Roland; Sippl, Simon; Lang, Charlotte; Basler, Thomas; Piriienko, Stanislav; Neuburger, Martin
99

Time-Domain Simulation Based Multi-Domain Optimization of Gallium Nitride-Based DC/DC Converters utilizing Spice Models

Autoren: Nuzzo, Jeremy; Koch, Dominik; Bosch, Michael; Fink, Tobias; Kallfass, Ingmar
100

Switching Behaviour of 3-Level Flying Capacitor GaN Half Bridge on a Multilevel AMB Substrate with integrated DC-Link Capacitor

Autoren: Wituski, Janusz; Kleimaier, Alexander
101

Hyperbolic Segmentation of Gate Driver Output Transistors for a Clean Switching of 650V GaN HEMTs Half Bridges

Autoren: Fiori, Franco; Nuebling, Marcus; Klotz, Frank
102

Ensuring optimal switching of power MOSFETs by compensating Vth variations using an integrated active gate driver

Autoren: Feng, Zhengyang; Kumar, Manish; Wang, Sheng; Kawai, Shusuke; Ueno, Takeshi; Ishihara, Hiroaki; Onizuka, Kohei
103

Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?

Autoren: Iannuzzo, Francesco
104

Reliability of GaN power chip embedding in different stack up

Autoren: Hammerl, Matthias; Abouie, Maryam; Rugen, Sarah; Sami, Alexander; Allirand, Laurence; Dresel, Fabian; Leib, Juergen
105

Development and testing of GaN Power Modules for EV traction inverters.

Autoren: Novo, Dima; Briga, Adam; Bunin, Gregory; Bunin, Ilia; Cohen, Oren; Chang, Joey; Dubinsky, Oleg; Firtel, Alex; Gitelmakher, Yuri; Iskhakbayev, Nissim; Liesabeths, Dieter; Montazeri, Mahsa; Romero, Memo; Rozanov, Evgeny; Shapiro, David; Stessin, Lev; Tsai, Ray; Volkov, Roman; Veprinsky, Valery; Veprinski, Dana; Roiter, Yulia; Wainwright, Simon
106

Is the Motor Insulation System Really Affected by High Voltage Transients?

Autoren: Fuerst, Markus; Bakran, Mark-M.
107

Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader

Autoren: Ahmed, Ahmed Sabry Eltaher; Hamed, Bahaeddine Ben; Perrin, Remi; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril; Jay, Jaques
108

Double-Side Cooled 1.2kV, 300A SiC MOSFET Phase-leg Modules for 200 kW, > 100 kW/L Traction Inverters

Autoren: Zhang, Zichen; Lu, Guo-Quan; Zhao, Xingchen; Dong, Dong; Arriola, Emmanuel; Ubando, Aristotle; Gao, Yuan
109

Power Cycling of Discrete SiC Power MOSFET Packages: Electro- Thermo-Mechanical Modeling of Bondwires

Autoren: Kovacevic-Badstuebner, Ivana; Hirth, Fabian; Race, Salvatore; Mengotti, Elena; Bianda, Enea; Jormanainen, Joni; Grossner, Ulrike
110

Dynamic calibration: How to properly estimate junction temperature in SiC MOSFETs subject to body diode voltage shift

Autoren: Noah, Mostafa; Fuentes, Carlos; Filsecker, Felipe