1
Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules
Autoren:
Uhlemann, Andre; Fath, Thorsten; Hymon, Erwin
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
2
Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?
Autoren:
Ocklenburg, Johanna; Rastjagaev, Eugen; Moeller, Eike; Wilde, Juergen
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
3
Keynote: Simulation and Test Vibration - Nonlinear Dynamic Effects in Vibration Durability of Electronic Systems
Autoren:
Dasgupta, Abhijit; Choi, Cholmin; Habtour, Ed
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
4
Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery
Autoren:
Gschwend, Dominic; Tick, Timo; Oggioni, Stefano; Paredes, Stephan; Matsumoto, Keiji; Tiwari, Manish K.; Poulikakos, Dimos; Brunschwiler, Thomas
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
5
Losses Comparison of Gallium Nitride and Silicon Transistors in a High Frequency Boost Converter
Autoren:
Wang, Wenbo; Pansier, Frans; Haan, S. W. H. de; Ferreira, J. A.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
6
Low-inductive inverter concept by 200 A / 1200 V half bridge in an EasyPACK 2B – following strip-line design
Autoren:
Mueller, Christian R.; Bayerer, Reinhold
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
7
Manufacturability and Reliability Assessment of Power Sandwich Technology
Autoren:
Josifovic, I.; Huesgen, T.; Mengotti, E.; Popovic-Gerber, J.; Ferreira, J.A.; Drofenik, U.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
8
Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Autoren:
Naumann, Falk; Maerz, Benjamin; Klengel, Robert; Schischka, Jan; Petzold, Matthias
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
9
Multi-chip circuit designs for silicon carbide power electronics
Autoren:
Nee, Hans-Peter; Rabkowski, Jacek; Peftitsis, Dimosthenis
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
10
New applications in power electronics for highly integrated high-speed magnetoresistive current sensors
Autoren:
Scherner, Simon; Slatter, Rolf
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
11
New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate
Autoren:
Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Nagase, Toshiyuki; Kuromitsu, Yoshirou
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
12
Novel Layout and Packaging for Lateral, Low-Resistance GaN-on-Si Power Transistors
Autoren:
Reiner, R.; Waltereit, P.; Benkhelifa, F.; Walcher, H.; Quay, R.; Schlechtweg, M.; Ambacher, O.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
13
Packaging and Reliability of Power Modules
Autoren:
Lutz, Josef
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
14
Packaging Very Fast Switching Semiconductors
Autoren:
Hoene, Eckart; Ostmann, Andreas; Marczok, Christoph
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
15
Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder
Autoren:
Park, S. W.; Nagao, S.; Sugahara, T.; Katoh, Y.; Ishino, H.; Sugiura, K.; Suganuma, K.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
16
Planar, double-layer magnetic inductors for low power, high frequency DC-DC converters
Autoren:
Haddad, Elias; Martin, Christian; Joubert, Charles; Allard, Bruno; Buttay, Cyril; Tannous, Tony Abi; Bevilacqua, Pascal
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
17
Power cycling capability of Modules with SiC-Diodes
Autoren:
Herold, Ch.; Schaefer, M.; Sauerland, F.; Poller, T.; Lutz, J.; Schilling, O.
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
18
Power Electronics for Renewable Energy Systems – Status and Trends
Autoren:
Blaabjerg, Frede; Ma, Ke; Yang, Yongheng
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
19
Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers
Autoren:
Rudzki, Jacek; Becker, Martin; Eisele, Ronald; Poech, Max; Osterwald, Frank
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
20
Power Semiconductor Packaging in PV Inverters up to 30 kW power, a difficult choice
Autoren:
Hinze, Juliane; Zacharias, Peter; Araujo, Samuel; Friebe, Jens; Leifert, Torsten
Konferenz:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems