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1

Reliability of Ag-Sintering and Sn-Ag TLP-Bonding for Mounting of SiC and GaN Devices

Autoren:
Bajwa, A. A.; Wilde, J.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

2

Reliability of Lead-free Large Area Solder Joints in IGBT Modules with Respect to Passive and Active Thermal Cycling

Autoren:
Beyer, H.; Sivasubramaniam, V.; Bayer, M.; Hartmann, S.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

3

Reliability study of SiC-JFET including new copper, planar and silver based interconnection and joining technologies

Autoren:
Uhlemann, A.; Weidner, K.; Mitic, G.; Stegmeier, S.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

4

Requirements of short-circuit detection methods and turn-off for wide band gap semiconductors

Autoren:
Maerz, Andreas; Bertelshofer, Teresa; Horff, Roman; Bakran, Mark-M.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

5

Review of Integration Trends in Power Electronics Systems and Devices

Autoren:
Majumdar, Gourab; Oi, Takeshi; Terashima, Tomohide; Idaka, Shiori; Nakajima, Dai; Goto, Yoichi
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

6

SiC Power devices complementing the silicon world - status and outlook

Autoren:
Friedrichs, Peter
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

7

Silver Sintering at Low Temperatures Without Using Pressure: An Approach for Joining Large Area Copper-to-Copper Interconnects

Autoren:
Oestreicher, Annerose; Lerch, Martin; Rabay, Battist; Roehrich, Tobias
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

8

Simulation of the Lifetime of Wire Bonds Modified through Wedge Trenches for Higher Reliability

Autoren:
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

9

Study on Packaging and Driver Integration with GaN Switches for Fast Switching

Autoren:
Klein, Kirill; Hoene, Eckart; Reiner, Richard; Quay, Ruediger
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

10

Switching performance of GaN-HEMT compared to Si-devices in new converters based on scalable converter cell structures

Autoren:
Kapaun, Florian; Rolff, Christian; Marquardt, Rainer
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

11

Thermal conductivity of Al2O3 substrates and precise 3D layer reconstruction – Key parameters for matching FEM simulations with thermal measurements

Autoren:
Amende, Tony; Friedrich, Matthias; Endres, Michael; Pihale, Sven; Schmidt, Ralf
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

12

Thermal Impedance Identification of a SiC JFET Module

Autoren:
Merkert, Arvid; Weber, Simon; Mertens, Axel
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

13

Thermal Performance and Reliability of Copper Thick Film Substrates

Autoren:
Gundel, Paul; Nowak, Torsten; Bawohl, Melanie; Challingsworth, Mark; Czwickla, Christoph; Garcia, Virginia; Nikolaidis, Ilias; Modes, Christina; Persons, Ryan; Reitz, Jessica; Shahbazi, Caitlin
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

14

Thermal Performance of High-Temperature Stable Die-Attachments for GaN HEMTs

Autoren:
Bajwa, A. A.; Reiner, R.; Quay, R.; Wilde, J.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

15

Towards Highly Integrated, Automotive Power SoCs Using Capacitors Operating at 100 V implemented in TSV

Autoren:
Gruenler, S.; Rattmann, G.; Erlbacher, T.; Bauer, A. J.; Krach, F.; Frey, L.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

16

Transient Thermal Impedance Model based on Online-Measurement of the On-State Voltage in IGBT Converters

Autoren:
Hambrecht, Andreas; Klitzke, Reno; Lehmann, Stephan; Wagenitz, Dennis; Dieckerhoff, Sibylle
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

17

Wear optimized consumables for copper wire bonding in industrial mass production

Autoren:
Broekelmann, Michael; Siepe, Dirk; Hunstig, Matthias; Guth, Karsten; Schnietz, Mark
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

18

Wide Band Gap Power Transistors Gate Driver Cutting Edge Bloc Functions

Autoren:
Grezaud, Romain; Ayel, François; Chapel, Antoine; Bergogne, Dominique
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems