1
Vias in DBC Substrates for Embedded Power Modules
Autoren:
Bach, Hoang Linh; Yu, Zechun; Letz, Sebastian; Bayer, Christoph Friedrich; Waltrich, Uwe; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
2
Vibrational resistance investigation of an IGBT gate driver utilizing Frequency Response Analysis (FRA) and Highly Accelerated Life Test (HALT)
Autoren:
Schriefer, Thomas; Hofmann, Maximilian; Maerz, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
3
Volumetric Evaluation of Passive Components in Multilevel Three- Phase Active Front-End AC-DC Converters
Autoren:
Schultheiss, Friedrich; Maerz, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems