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21

Digital Gate Drive Control Method for Active Voltage Balancing of Series-connected IGBT Devices

Autoren:
Tripathi, Ravi Nath; Arimoto, Takaaki; Tsukuda, Masanori; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

22

Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts

Autoren:
Martin, Elodie; Khazaka, Rabih; Martineau, Donatien; Azzopardi, Stephane; Alexis, Joel
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

23

Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors

Autoren:
Kuczmik, Adam; Hoffmann, Stefan; Hoene, Eckart
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

24

Dynamic AC Power Cycling with Coupled Inverters Operating Under Application-Oriented Conditions

Autoren:
Nitzsche, Maximilian; Baron, Kevin Munoz; Ziegler, Philipp; Wagner, Felix; Roth-Stielow, Joerg
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

25

Dynamic Current Balancing of Parallel Connected IGBT Devices using PCB Sensor for Integration in Power Modules

Autoren:
Tripathi, Ravi Nath; Tsukuda, Masanori; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

26

Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding

Autoren:
Itose, Tomoya; Kawagoe, Akihiro; Imakiire, Akihiro; Kozako, Masahiro; Hikita, Masayuki; Tatsumi, Kohei; Iizuka, Tomonori; Morisako, Isamu; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

27

Electromagnetic switching cell design and characterization for WBG power semiconductors

Autoren:
Klein, Kirill; Hoene, Eckart; Lang, Klaus-Dieter
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

28

EMI Imaging System Using a Double-pulse-compose-method for Front-loading of Noise Evaluation

Autoren:
Matsuo, Kota; Tsukuda, Masanori; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

29

End-of-life mechanism due to cyclic thermomechanical loading of power modules with .XT joining technology

Autoren:
Methfessel, Torsten; Jaehme, Hendrik
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

30

Evaluation of a GaN HEMT Half-Bridge embedded to a Multilayer Aluminum Nitride Substrate

Autoren:
Kuring, Carsten; Wolf, Mihaela; Geng, Xiaomeng; Hilt, Oliver; Boecker, Jan; Wieczorek, Nick; Wuerfl, Joachim; Dieckerhoff, Sibylle
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

31

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding

Autoren:
Schemmel, Reinhard; Scheidemann, Claus; Hemsel, Tobias; Kirsch, Olaf; Sextro, Walter
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

32

Experimental Study of the Coss-Losses Occurring During ZVS Transitions – Emphasis on Low and High Voltage GaN-HEMTs

Autoren:
Kohlhepp, Benedikt; Kuebrich, Daniel; Duerbaum, Thomas
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

33

Full-SiC Integrated Power Module based on Planar Packaging Technology for High Efficiency Power Converters in Aircraft Applications

Autoren:
Raab, Oliver; Guacci, Mattia; Griffo, Antonio; Kriegel, Kai; Heller, Morris; Wang, Jiabin; Bortis, Dominik; Schulz, Martin; Kolar, Johann W.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

34

Gallium Nitride in Automotive High-Speed Drive Applications

Autoren:
Antensteiner, Benjamin; Lamplmayr, Patrick; Moerwald, Michael; Reisinger, Martin; Gruber, Wolfgang; Haeusler, Lukas
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

35

Generic thermal cooling design for multicell converters

Autoren:
Crebier, Jean Christophe; Andreta, Andre; Avenas, Yvan; Lembeye, Yves
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

36

H3TRB Test on 6.5 kV SiC-JBS Diodes

Autoren:
Hoffmann, Felix; Mihaila, Andrei; Soler, Victor; Kaminski, Nando
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

37

Half-bridge Concepts for High Blocking Voltage GaN HEMTs (EU Public Funded Project ‘InRel-NPower‘

Autoren:
Rittner, Martin; Kessler, Ulrich; Konjedic, Tine; Naundorf, Joerg; Kriegel, Kai; Schulz, Martin; Meneghesso, Gaudenzio
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

38

High Frequency DC-DC Converter for an Integrated Electrical Excitation of an Axial Flux Machine with Fiber-composite Rotor: A Multidisciplinary Approach

Autoren:
Schneider, Philipp; Reimann, Tobias; Endert, Fabian; Heidrich, Tobias; Moeckel, Andreas; Neitzel, Benedikt
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

39

High Power Density EMI Mitigation in Power Electronics Converters: Active and Integrated Solutions

Autoren:
Luo, Fang; Narayanasamy, Balaji; Emon, Asif
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

40

Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board

Autoren:
Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu; De Doncker, Rik W.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems