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1

12x12 MIMO-OFDM Realtime Implementation for 3GPP LTE+ on a Cell Processor

Autoren:
Kühling, David; Ibing, Andreas; Jungnickel, Volker
Konferenz:
European Wireless 2008 - 14th European Wireless Conference

2

2 Jahre Bleifreies Löten - Erfahrungen mit Leiterplatten Endschichten

Autoren:
Walz, Dieter; Oezkoek, Mustafa; Heinz, Günter; Lamprecht, Sven
Konferenz:
Elektronische Baugruppen und Leiterplatten - EBL 2008 - Systemintegration und Zuverlässigkeit - 4. DVS/GMM-Fachtagung

3

2-Dimensional Ultra-Wideband Antenna Array for Amplitude Monopulse Angle of Arrival Estimation

Autoren:
Blech, Marcel D.; Benzinger, Michael O.; Eibert, Thomas F.
Konferenz:
GeMIC 2008 - German Microwave Conference

4

20 W Class A Power Amplifier for Wideband

Autoren:
Sayed, Ahmed; Tanany, Ahmed Al; Boeck, Georg
Konferenz:
GeMIC 2008 - German Microwave Conference

5

3-Dimensional bridged structures by thermal-UV imprint using a novel mask

Autoren:
Okuda, Keisuke; Kawata, Hiroaki; Hirai, Yoshihiko
Konferenz:
EMLC 2008 - 24th European Mask and Lithography Conference

6

3D Integration of Power Semiconductor Devices based on Surface Bump Technology

Autoren:
Mermet-Guyennet, Michel; Castellazzi, Alberto; Lasserre, Philippe; Saiz, José
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

7

3D Plotted Scaled Electroplated Ship Models for Broadband Shipboard HF Antenna Measurements from 0.4 - 6 GHz

Autoren:
Berndt, Olaf; Gruzewski, Sven; Fickenscher, Thomas
Konferenz:
GeMIC 2008 - German Microwave Conference

8

3D SAR Processing for a Fast Scanning Millimetre-Wave Short Range Imaging System

Autoren:
Gumbmann, Frank; Tran, Phat Hue; Weinzierl, Jochen; Schmidt, Lorenz-Peter
Konferenz:
EUSAR 2008 - 7th European Conference on Synthetic Aperture Radar

9

3D subsurface SAR for humanitarian demining

Autoren:
Sato, Motoyuki; Feng, Xuan; Takahashi, Kazunori
Konferenz:
EUSAR 2008 - 7th European Conference on Synthetic Aperture Radar

10

3D Urban Remote Sensing using Spectral Analysis Techniques applied to L-Band Dual-baseline POL-InSAR Images

Autoren:
Sauer, S.; Ferro-Famil, L.; Reigber, A.; Pottier, E.
Konferenz:
EUSAR 2008 - 7th European Conference on Synthetic Aperture Radar

11

3D Wafer Level System Integration – Requirements & Technologies

Autoren:
Klumpp, A.; Wolf, M. J.; Ramm, P.; Wunderle, B.; Reichl, H.
Konferenz:
Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components

12

3G HSDPA evolution: MIMO and 64QAM Performance in Macrocellular Deployments

Autoren:
Tenorio, Santiago; Pezennec, Yannick le; Sierra, Manuel
Konferenz:
European Wireless 2008 - 14th European Wireless Conference

13

45nm Node Registration Metrology on LTEM EUV Reticles

Autoren:
Laske, Frank; Kinoshita, Hiroshi; Nishida, Naoki; Kenmochi, Daisuke; Ota, Hitoshi; Tanioka, Yukitake; Czerkas, Slawomir; Schmidt, Karl-Heinrich; Adam, Dieter; Roeth, Klaus-Dieter
Konferenz:
EMLC 2008 - 24th European Mask and Lithography Conference

14

4G Mobilfunk – Schlüsselthemen der Forschung (UMIC)

Autoren:
Ascheid, Gerd
Konferenz:
VDE-Kongress 2008 - Zukunftstechnologien: Innovationen - Märkte - Nachwuchs

15

60 GHz SiGe HBT Chip Set for High Speed Wireless Communication Systems

Autoren:
Subramanian, Viswanathan; Keusgen, Wilhelm; Do, Van-Hoang; Boeck, Georg
Konferenz:
GeMIC 2008 - German Microwave Conference

16

60 GHz Wireless Photonic Link System for 12.5Gb/s Data Transmission

Autoren:
Stöhr, Andreas; Weiß, Mario; Fedderwitz, Sascha; Jäger, Dieter; Huchard, Mathieu; Charbonnier, Benoit
Konferenz:
Photonische Netze - 9. ITG-Fachtagung

17

600V Converter/Inverter/Brake (CIB) - Module with integrated SOI Gate Driver IC for Medium Power Applications

Autoren:
Vogler, B.; Roßberg, M.; Herzer, R.; Reusser, L.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

18

802.15.4 Wireless Sensor Network

Autoren:
Maglione, Alfredo; Battisti, Nicola
Konferenz:
Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components

19

A 14W SPST Switch with Four PIN-Diodes in a 0402-SMD-Package

Autoren:
Heuermann, Holger
Konferenz:
GeMIC 2008 - German Microwave Conference

20

A 5-bit K-Band MEMS Phase Shifter in a 1-Level Plastic Package

Autoren:
Bastioli, S.; Maggio, F. Di; Farinelli, P.; Giacomozzi, F.; Margesin, B.; Ocera, A.; Pomona, I.; Russo, M.; Sorrentino, R.
Konferenz:
Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components