1
The new generation of Gallium Nitride Power devices; breaking the limits of ease-of-use and reliability
Autoren:
Udrea, Florin
Konferenz:
PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
2
The New XHP2 Module Using 3.3 kV CoolSiC MOSFET and .XT Technology
Autoren:
Buerger, Matthias; Hoppe, Karl-Heinz; Schraml, Konrad; Wedi, Andre
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
3
The Next Step in Power MOSFET Technology Enables Further Increase in Power Supply Efficiencies
Autoren:
Mazzer, Simone; Braz, Cesar; Siemieniec, Ralf; Laforet, David; Pree, Elias; Ferrara, Alessandro
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
4
The Power loss reduction from continuous PWM to discontinuous PWM in a 3L ANPC converter
Autoren:
Wang, Heng; Wang, Yixuan
Konferenz:
PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
5
The Research on Influencing Factors of 650V IGBT’s Turn-off dVce/dt Controllability
Autoren:
Li, Rui; Ma, Keqiang; Wang, Siliang; Xiang, Yi; Liu, Liangkai; Yang, Ke
Konferenz:
PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
6
The Resonant Characteristics Comparison between Primary-Side Resonant and Secondary-Side Resonant Active Clamp Flyback
Autoren:
Chen, Yanglin; Yang, Fei
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
7
The Smart Grid LAB in Hesse – Active Maximization of Annual Us-age Time of Electrical Grids Using Flexibilities while Ensuring Data Security and Resilience at the Same Time
Autoren:
Birkner, Peter; Schaldach, Anja; Jeromin, Ingo; Krontiris, Athanasios; Neukamp, Till; Pfeffer, Sophia
Konferenz:
ETG Kongress 2023 - ETG-Fachtagung
8
Thermal annealing of Nb2O5 and Ta2O5 thin films for CMOS based chemical sensors
Autoren:
Al-Falahi, Falah; Beale, Christopher; Kurth, Eberhard; Reinig, Peter; Hild, Olaf R.
Konferenz:
MikroSystemTechnik Kongress 2023 - Kongress
9
Thermal Considerations for Y Capacitors in Wide Band-Gap Based Inverters
Autoren:
Tranchero, Maurizio; Santero, Paolo
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10
Thermal Evaluation of Substrate Technologies Used for Power Peak Management in SSPC Modules
Autoren:
Khazaka, Rabih; Scoggin, Guy; Avenas, Yvan; Youssef, Toni; Gautier, Cyrille; Schanen, Jean Luc; Muckenhirn, Sylvain; O'Connor, Lesia; Azzopardi, Stephane
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11
Thermal Management of a Compact High Power Factor Air Cooled Isolated 12kW 9 Litre SiC Three-Phase AC/DC Converter
Autoren:
da Cunha, Jean C.; Vykukal, Radko; de Sousa, Luis
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
12
Thermal model of fully-molded, multi-chip power modules
Autoren:
Young, Sungmo; Lee, Taejin; Kwon, Hyukdong
Konferenz:
PCIM Asia 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
13
Thickness of aluminum-oxide layer in insulated bearings to reduce circular bearing currents in a 110 kW induction machine
Autoren:
Safdarzadeh, Omid; Binder, Andreas
Konferenz:
Elektromechanische Antriebssysteme 2023 - 9. Fachtagung (VDE OVE)
14
Thin Film Under Bump Metallization for Wafer Level Packaging
Autoren:
Knechtel, Roy; Seyring, Martin; Wenig, Micaela; Goebelt, Manuela; Thiedke, Dominik; Goetz, Volker
Konferenz:
MikroSystemTechnik Kongress 2023 - Kongress
15
Threat of Low-Cost Jammers: The effects on Visible Light Communication Systems
Autoren:
Tjabben, Annika; Noushinfar, Marjan; Herbst, Jan; Rueb, Matthias; Lipps, Christoph; Schotten, Hans Dieter
Konferenz:
Mobilkommunikation - 27. ITG-Fachtagung
16
Three-dimensional folded MEMS manufacturing for an efficient use of area
Autoren:
Becker, Dennis; Bittner, Achim; Dehe, Alfons
Konferenz:
MikroSystemTechnik Kongress 2023 - Kongress
17
Threshold Voltage Hysteresis in Compact Models of SiC MOSFETs
Autoren:
Sun, Qing; Huerner, Andreas; Sochor, Paul; Elpelt, Rudolf
Konferenz:
PCIM Europe 2023 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
18
Tie open point relocation as possible replacement for the step voltage regulator
Autoren:
Hachimy, Khalid; Yerima, Yuven; Truckenmueller, Frank; Bernhardt, Alfred; Schmid, Christoph; Eilenberger, Simon
Konferenz:
ETG Kongress 2023 - ETG-Fachtagung
19
Time Series Data Splitting for Short-Term Load Forecasting
Autoren:
Hasanov, Magsud; Wolter, Martin; Glende, Eric
Konferenz:
PESS + PELSS 2022 - Power and Energy Student Summit
20
TiN-Si Schottky Diodes for SWIR Detection
Autoren:
Augel, Lion; Wen, Hanying; Knobbe, Jens
Konferenz:
MikroSystemTechnik Kongress 2023 - Kongress