Cover IEC TR 60286-7:2019

IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Ausgabedatum: 2019-10
Edition: 1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 24 VDE-Artnr.: 248126


IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.