Cover IEC 62769-6:2023

IEC 62769-6:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

Ausgabedatum: 2023-04
Edition: 3.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 14 VDE-Artnr.: 251730


IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.