Cover IEC 62769-6:2023 RLV

IEC 62769-6:2023 RLV

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

Ausgabedatum: 2023-04
Edition: 3.0
Sprache: EN - englisch
Seitenzahl: 42 VDE-Artnr.: 251731


IEC 62769-6:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.