Cover IEC 62769-101-2:2023 RLV

IEC 62769-101-2:2023 RLV

Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE

Ausgabedatum: 2023-04
Edition: 3.0
Sprache: EN - englisch
Seitenzahl: 84 VDE-Artnr.: 251754


IEC 62769-101-2:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784-1, CP 1/2 (Foundation™ Fieldbus HSE)[1].

[1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.