Cover IEC 62769-103-1:2023
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IEC 62769-103-1:2023

Field Device Integration (FDI)® - Part 103-1: Profiles - PROFIBUS

Ausgabedatum: 2023-04
Edition: 3.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 68 VDE-Artnr.: 251756

Inhaltsverzeichnis

IEC 62769-103-1:2023 is available as IEC 62769-103-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA).

[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

[2] PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.