IEC 60749-26:2025Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
320,00 €
|
IEC 60749-26:2025 CMVSemiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
640,00 €
|
IEC 60749-21:2025 RLVSemiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
264,00 €
|
IEC 60749-21:2025Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
155,00 €
|
IEC 60749-23:2025 RLVSemiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
68,00 €
|
IEC 60749-23:2025Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
40,00 €
|
IEC 60749-7:2025Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
80,00 €
|
IEC 60749-24:2025 RLVSemiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
68,00 €
|
IEC 60749-24:2025Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
40,00 €
|
IEC 60749-22-1:2025Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
365,00 €
|
IEC 60749-22-2:2025Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
249,99 €
|
IEC 62007-2:2025Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
280,00 €
|
IEC 60749-34-1:2025Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
200,00 €
|
IEC 63378-3:2025Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
80,00 €
|
IEC 60747-5-4:2022/AMD1:2024Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
20,00 €
|
IEC 60747-5-4:2022+AMD1:2024 CSV (Consolidated Version)Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
465,00 €
|
IEC 63378-2-1:2024Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
80,00 €
|
IEC 60749-5:2023Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
40,00 €
|
IEC 60749-5:2023 RLVSemiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
68,00 €
|
IEC 63287-2:2023Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
80,00 €
|
Seite 1 von 9
© VDE VERLAG GmbH, Berlin - Offenbach