IEC 61189-1:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 62326-4:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC 62326-4-1:1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

IEC 61249-5-4:1996

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

IEC 61249-8-7:1996

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

IEC 61249-5-1:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-7-1:1995

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper