Anzeige
Sortierung
Seite 3 von 3

IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

20,00 € 

IEC 60191-2:1966/AMD3:2001

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

80,00 € 

IEC 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

40,00 € 

IEC 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

40,00 € 

IEC 60191-2:1966/AMD2:2001

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

20,00 € 

IEC 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

80,00 € 

IEC 60191-2:1966/AMD1:2001

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

20,00 € 

IEC 60191-6-3:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

115,00 € 

IEC 60191-2Z:2000

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

20,00 € 

IEC 60191-2Y:2000

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

155,00 € 

IEC 60191-2X:1999/COR1:2000

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

0,00 € 

IEC 60191-3:1999

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

320,00 € 

IEC 60191-2X:1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions

80,00 € 

IEC 60191-2W:1999

Twenty-first supplement

80,00 € 

IEC 60191-2V:1998

Twentieth supplement

40,00 € 

IEC 60191-2U:1997

Nineteenth supplement

20,00 € 

IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

249,99 € 

IEC 60191-2T:1996

Eighteenth supplement

10,00 € 

IEC 60191-2:1966

Mechanical standardization of semiconductor devices. Part 2: Dimensions

450,00 €