IEC 62047-4:2026 RLVSemiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
209,72 €
|
IEC 62047-4:2026Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
123,05 €
|
IEC 62047-49:2025Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
21,40 €
|
IEC 62047-53:2025Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
85,60 €
|
IEC 62047-50:2025Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
85,60 €
|
IEC 62047-46:2025Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
85,60 €
|
IEC 62047-45:2025Semiconductor devices - Micro-electromechanical devices - Part 45: Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures
85,60 €
|
IEC 62047-47:2024Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
85,60 €
|
IEC 62047-48:2024Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
85,60 €
|
IEC 62047-43:2024Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
123,05 €
|
IEC 62047-44:2024Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
123,05 €
|
IEC 62047-42:2022Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
171,20 €
|
IEC 62047-40:2021Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
42,80 €
|
IEC 62047-38:2021Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
85,60 €
|
IEC 62047-41:2021Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
278,20 €
|
IEC 62047-37:2020Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
123,05 €
|
IEC 62047-35:2019Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
171,20 €
|
IEC 62047-31:2019Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
85,60 €
|
IEC 62047-33:2019Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
171,20 €
|
IEC 62047-34:2019Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
85,60 €
|
Seite 1 von 3
© VDE VERLAG GmbH, Berlin - Offenbach