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IEC 63003:2015

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

400,00 € 

IEC 63004:2015

Standard for receiver fixture interface

400,00 € 

IEC TR 62878-2-2:2015

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

80,00 € 

IEC 62878-1-1:2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

300,00 € 

IEC 61760-4:2015

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

235,00 € 

IEC 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

150,00 € 

IEC TS 62878-2-1:2015

Device embedded substrate - Part 2-1: Guidelines - General description of technology

190,00 € 

IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

150,00 € 

IEC TS 62878-2-4:2015

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

235,00 € 

IEC 60068-2-58:2015

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

235,00 € 

IEC 62014-4:2015

IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows

425,00 € 

IEC 62014-5:2015

Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs

270,00 € 

IEC 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

270,00 € 

IEC 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

235,00 € 

IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

150,00 € 

IEC TR 62699-1:2014

Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

235,00 € 

IEC 62137-4:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

270,00 € 

IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

375,00 € 

IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

150,00 € 

IEC 61249-4-18:2013

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

80,00 €