IEC 60191-2:1966/AMD16:2007

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-16:2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

IEC 60191-2:1966/AMD13:2006

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD14:2006

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD15:2006

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD12:2006

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD11:2004

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD10:2004

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-2:1966/AMD9:2003

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-10:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

IEC 60191-2:1966/AMD8:2003

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

IEC 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

IEC 60191-6-2:2001/COR1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-2:1966/AMD7:2002

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

IEC 60191-2:1966/AMD6:2002

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

IEC 60191-2:1966/AMD5:2002

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

IEC 60191-6-2:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-2:1966/AMD4:2001

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

IEC 60191-2:1966/AMD3:2001

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions