IEC 61249-2-21:2003

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-9:2003

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-8:2003

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-10:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-7:2002

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

IEC 61249-2-4:2001

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

IEC 61249-2-13:1999

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

IEC 61249-3-4:1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

IEC 61249-3-3:1999

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

IEC 61249-3-5:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

IEC 61249-2-12:1999

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

IEC 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

IEC 61249-5-4:1996

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

IEC 61249-8-7:1996

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

IEC 61249-5-1:1995

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-7-1:1995

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper