IEC TR 61760-5-1:2024Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
155,00 €
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IEC TR 61760-3-1:2022Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
200,00 €
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IEC 61760-2:2021Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
80,00 €
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IEC 61760-2:2021 RLVSurface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
136,00 €
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IEC 61760-3:2021Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
200,00 €
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IEC 61760-1:2020Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
280,00 €
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IEC 61760-4:2015/AMD1:2018Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
10,00 €
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IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
439,99 €
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IEC 61760-4:2015Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
249,99 €
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