IEC 62137-4:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC 62137-3:2011

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC 62137-1-5:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

IEC 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

IEC 62137-1-3:2008

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

IEC 62137-1-2:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test