IEC 60749-19:2003/AMD1:2010Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
10.00 €
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IEC 60749-32:2002/AMD1:2010Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
10.00 €
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IEC 62615:2010Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level
115.00 €
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IEC 62417:2010Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
20.00 €
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IEC TR 62258-8:2008Semiconductor die products - Part 8: EXPRESS model schema for data exchange
190.00 €
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IEC 60749-38:2008Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
80.00 €
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IEC 62374:2007Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
150.00 €
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IEC 62258-5:2006Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
80.00 €
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IEC 62258-6:2006Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
40.00 €
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IEC 62373:2006Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
80.00 €
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IEC 60749-35:2006Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
150.00 €
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IEC 60749-27:2006Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
80.00 €
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