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IEC TR 62258-8:2008Semiconductor die products - Part 8: EXPRESS model schema for data exchange
180.00 €
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IEC 60749-38:2008Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
70.00 €
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IEC 60749-37:2008Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
110.00 €
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IEC 62374:2007Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
145.00 €
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IEC 62258-5:2006Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
70.00 €
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IEC 62258-6:2006Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
40.00 €
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IEC 62373:2006Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
70.00 €
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IEC 60749-35:2006Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
145.00 €
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IEC 60749-27:2006Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
70.00 €
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IEC 60749-33:2004Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
40.00 €
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IEC 60749-24:2004Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
40.00 €
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IEC 60749-23:2004Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
40.00 €
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IEC 60749-11:2002/COR2:2003Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
0.00 €
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IEC 60749-31:2002/COR1:2003Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
0.00 €
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IEC 60749-32:2002/COR1:2003Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
0.00 €
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IEC 60749-1:2002/COR1:2003Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
0.00 €
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