IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IEC 60749-11:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-32:2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-31:2002

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

IEC 60749-8:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

IEC 60749-1:2002

Semiconductor devices - Mechanical and climatic test methods - Part 1: General

IEC 60749-11:2002

Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 60749-2:2002

Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure