Thermal Packaging Concept for LTCC Microwave Power Applications
Konferenz: GeMIC 2008 - German Microwave Conference
10.03.2008 - 12.03.2008 in Hamburg-Harburg, Germany
Tagungsband: GeMIC 2008
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Baras, Torben; Jacob, Arne F. (Institut für Hochfrequenztechnik - Tech. Univ. Hamburg-Harburg, 21073 Hamburg, Germany)
Inhalt:
An enhanced packaging concept is presented. LTCC (Low Temperature Cofired Ceramics) is simultaneously used as the housing and the host material for RF- and DC-interconnects and transitions. The electronics package is evaluated regarding its thermal and electrical performance. To this end a commercial medium power amplifier (MPA) chip in the range from 17 to 23GHz with up to 1.4W dissipated power is used. The investigations focus on the thermal performance and the implementation issues of the module and less on the amplifier performance. The general approach is highly suitable for realizing low cost hermetic power modules.