Built-in EMC for integrated power electronics systems
Konferenz: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11.03.2008 - 13.03.2008 in Nuremberg, Germany
Tagungsband: CIPS 2008
Seiten: 10Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Schanen, Jean-Luc; Roudet, James (G2ELab, CNRS UMR5269 INPG-UJF – ENSIEG-B.P.46, 38402 St Martin d'Heres Cedex France)
Power electronics is today the most common way for electrical power conversion. However, a set of new problems, linked to ElectroMagnetic Compatibility (EMC) arises from the generalization of this very attractive technology: high frequency disturbances, generated from power switching, must be mitigated to avoid the disturbance of the device itself, or its environment. This paper proposes an investigation of several available solutions to reduce the ElectroMagnetic Interferences (EMI) of power electronics devices (power modules and associated interconnections), by using cost free solutions, lying on a proper choice of layout and on the exploitation of some technological properties of the module. Both internal and external EMC will be considered.