Review on Highly Integrated Solutions for Power Electronic Devices
Konferenz: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11.03.2008 - 13.03.2008 in Nuremberg, Germany
Tagungsband: CIPS 2008
Seiten: 7Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Schulz-Harder, Jürgen (Electrovac Curamik GmbH, Im Gewerbepark D75, 93059 Regensburg)
Applications of power electronic devices in cars and trains have been becoming a driving force for new developments in power electronic industry. The need for weight and space reduction and high reliability are demanding highly integrated systems, improved interconnects and the use of new materials regarding the match of thermal expansion and thermal conductivity. One of the key subjects in space and weight reduction is the cooling of power electronics. Conventional assemblies used in industrial applications based on standard modules with air cooled aluminium heat sinks are too heavy and voluminous for automotive uses. Liquid cooling is becoming the solution for higher power as used in hybrid electrical vehicles.