The Road to the Next Generation Power Module – 100% Solder Free Design

Konferenz: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11.03.2008 - 13.03.2008 in Nuremberg, Germany

Tagungsband: CIPS 2008

Seiten: 10Sprache: EnglischTyp: PDF

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Scheuermann, Uwe; Beckedahl, Peter (SEMIKRON Elektronik GmbH & Co. KG, Nürnberg, Germany)

The reliability of classical power modules with various solder interfaces is not sufficient to meet the demand of progressive applications in power electronics. Technologies were developed in the last decade to improve the reliability. The elimination of the base plate prevents the solder fatigue failure in the substrate solder layer and permits the implementation of arbitrary ceramic materials. Spring contacts and pressure contacts replace soldered terminals. Diffusion sintering substitutes the chip solder layer. The combination of these technologies leads to a module architecture without any solder layer that has the potential to exceed the reliability limits of classic modules.