Cooling of Insulated Assemblies

Konferenz: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11.03.2008 - 13.03.2008 in Nuremberg, Germany

Tagungsband: CIPS 2008

Seiten: 6Sprache: EnglischTyp: PDF

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Förster, Stefan; Lindemann, Andreas (Otto-von-Guericke-University Magdeburg, Institute of Electric Power Systems, Chair for Power Electronics, Universitätsplatz 2, D – 39106 Magdeburg)

Considerations of this paper refer to the appearance of thermal resistances in sub-systems with integrated insulation e.g. power semiconductor discretes and modules. The analysis of thermal resistance depending on geometrical data of layered assemblies is discussed. Analytical calculation and finite element simulation yield an approach in thermal optimisation with respect to improvement of heat flux passage through insulation with poor thermal conductivity or determination of minimum mounting distance needed between heat dissipating elements on substrate. Knowledge of heat flux distribution within layers provides the possibility to estimate steady state thermal behaviour, that means thermal resistance.