Cooling of Insulated Assemblies

Inhalt:
Considerations of this paper refer to the appearance of thermal resistances in sub-systems with integrated insulation e.g. power semiconductor discretes and modules. The analysis of thermal resistance depending on geometrical data of layered assemblies is discussed. Analytical calculation and finite element simulation yield an approach in thermal optimisation with respect to improvement of heat flux passage through insulation with poor thermal conductivity or determination of minimum mounting distance needed between heat dissipating elements on substrate. Knowledge of heat flux distribution within layers provides the possibility to estimate steady state thermal behaviour, that means thermal resistance.