Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology
Konferenz: GeMiC 2009 - German Microwave Conference
16.03.2009 - 18.03.2009 in München, Germany
Tagungsband: GeMiC 2009
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Richter, Marius D.; Schneider, Martin (Department of RF & Microwave Engineering, University of Bremen, Otto-Hahn-Allee, 28359 Bremen, Germany)
Becker, Karl-F.; Böttcher, Lars (Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany)
A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.