Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band
Konferenz: EuCAP 2009 - 3rd European Conference on Antennas and Propagation
23.03.2009 - 27.03.2009 in Berlin, Germany
Tagungsband: EuCAP 2009
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Akkermans, J. A. G.; Kazim, M. I.; Yu, Y.; Herben, M. H. A. J.; Baltus, P. G. M.; Smulders, P. F. M. (Electrical Engineering, Eindhoven University of Technology (TU/e), Eindhoven, The Netherlands)
The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.