High-Gain On-Chip Antennas for LSI Intra-/Inter-Chip Wireless Interconnection

Konferenz: EuCAP 2009 - 3rd European Conference on Antennas and Propagation
23.03.2009 - 27.03.2009 in Berlin, Germany

Tagungsband: EuCAP 2009

Seiten: 5Sprache: EnglischTyp: PDF

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Kimoto, K.; Sasaki, N.; Kubota, S.; Moriyama, W.; Kikkawa, T. (Research Institute for Nanodevice and Bio Systems, Hiroshima University, 1-4-2 Kagamiyama, Higashi-hiroshima, Hiroshima 739-8527, Japan)

A wireless interconnection technology using on-chip antennas has been proposed for three dimensional packaging of LSI chips. The issues of on-chip antennas are extremely low gain due to lossy Si substrates. In this study, we developed a high gain on-chip antenna structure by thinning the Si substrate thickness and optimizing interposer thickness underlying the Si substrate. The transmission coefficient increased from -93 dB to -31 dB at the distance of 20 mm for inter-chip communication between 180 nm CMOS chips.