Parametric Extraction of Lumped Via Models

Konferenz: ISTET 2009 - VXV International Symposium on Theoretical Engineering
22.06.2009 - 24.06.2009 in Lübeck, Germany

Tagungsband: ISTET 2009

Seiten: 4Sprache: EnglischTyp: PDF

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Heinrich, Gerd; Dickmann, Stefan (Helmut–Schmidt–Universität / Universität der Bundeswehr Hamburg, Germany)

Vias in multilayer PCBs can be described using lumped models since their geometric dimensions are small in comparison to the signal wavelength. The elements of these models can be derived directly from physics and calculated using analytical formulas. When using these formulas as initial parameters for an optimisation algorithm the model parameters for a real via geometry can be extracted using the reference data from measurements or numerical simulations.