Integration Using the Hybrid Silicon Platform
Konferenz: ECOC 2009 - 35th European Conference on Optical Communication
20.09.2009 - 24.09.2009 in Vienna, Austria
Tagungsband: ECOC 2009
Seiten: 2Sprache: EnglischTyp: PDF
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Autoren:
Bowers, John E.; Chen, Hui-Wen; Liang, Di (Department of Electrical and Computer Engineering, University of California, Santa Barbara, California, 93106, USA)
Oakley, Douglas C.; Napoleone, Antonio; Chapman, David C.; Chen, Chang-Lee; Juodawlkis, Paul W. (Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts, 02420, USA)
Inhalt:
A brief review of recent progress in photonic integrated circuits (PIC) and connection to the electronic IC roadmap is presented. High-quality wafer bonding, electrically pumped lasers and high speed modulators are essential technologies for high speed interconnects and mass production of optoelectronics.