Challenges of Si Photonics for on-chip Integration
Konferenz: ECOC 2009 - 35th European Conference on Optical Communication
20.09.2009 - 24.09.2009 in Vienna, Austria
Tagungsband: ECOC 2009
Seiten: 3Sprache: EnglischTyp: PDF
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Autoren:
Wada, K. (Department of Materials Engineering, The University of Tokyo, Japan)
Inhalt:
To clear fundamental limits of electrical interconnection, WDM optical interconnection should be implemented in Si photonics. Challenging issues are strongly connected with temperatures in CMOS processing and in operation. We will report a solution of Ge backend processing and a proposal to avoid temperature fluctuation of light wavelengths.