Assembly of pressure sensor chips as an example for integrated MEMS for high temperature applications
Konferenz: MikroSystemTechnik - KONGRESS 2009
12.10.2009 - 14.10.2009 in Berlin, Germany
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Klieber, Robert; Goehlich, Andreas; Trieu, Hoc Khiem; Kappert, Holger; Grabmaier, Anton (Fraunhofer IMS, Finkenstraße 61, 47057 Duisburg)
Fast decrease of device dimensions, rapid growth of the number of elements per integrated circuit device (IC) and the increasing amount of interconnections between the chip and the PCB lead to a more complex design and production of the ICs and to higher demands towards packaging technology as well. This is especially true in the field of high temperature electronics, with operating temperatures up to 250deg C for example within automotive, geothermal wells, aerospace, space and nuclear power applications. For this temperature range we present an evaluation of materials for packaging of high temperature ICs, a high temperature capable pressure sensor as an example for an integrated MEMS and its temperature dependence.