Electrothermal, Easily Handled Silicon Micro Gripper

Konferenz: MikroSystemTechnik - KONGRESS 2009
12.10.2009 - 14.10.2009 in Berlin, Germany

Tagungsband: MikroSystemTechnik

Seiten: 4Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Hoxhold, Björn; Büttgenbach, Stephanus (Institute for Microtechnology, Technische Universität Braunschweig, Germany)

This paper presents a new batch process to fabricate thermally driven silicon micro grippers for handling and manipulation of objects smaller than 25 µm. Furthermore it demonstrates how the usage of silicon on insulator (SOI) technology affords an easy way to achieve a robust gripper gearing with fine gripping tips. Thermal expansion actuators are indirectly heated by electrical heating resistors, driving the flexure gearing. Adapted to the gripper design, a customized gripper mounting mechanism is presented, that enables a fast and easy gripper handling, reducing time and costs for the user. Finally experimental results and electrical characteristics for the sophisticated gripper design are presented.