Power Module with Additional Low Inductive Current Path

Konferenz: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
16.03.2010 - 18.03.2010 in Nuremberg, Germany

Tagungsband: CIPS 2010

Seiten: 6Sprache: EnglischTyp: PDF

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Frisch, Michael (Vincotech GmbH, Biberger Str. 93, 82008 Unterhaching, Germany)
Ernö, Temesi (Vincotech Kft., Kossuth Lajos u. 59, 2060 Bicske, Hungary)

Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path. An alternative to this approach, which is outlined within this writing, is a concept using today’s standard power module construction but providing an additional ultra low inductive path for the transient current.