Thermo-mechanical stress analysis for a multilayer SMT manufacturing technology
Konferenz: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
16.03.2010 - 18.03.2010 in Nuremberg, Germany
Tagungsband: CIPS 2010
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A. (Delft University of Technology, Mekelweg 4, Delft, 2628CD, The Netherlands)
A novel stacked converter construction technology, Power Sandwich that lends itself towards automation and high power densities has been proposed. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height are stacked between planar substrates in a few stack layers. Double-sided x-dim components are soldered to both top and bottom sides. The concept of Power Sandwich integration concept with x-dim components changes the physics of failure, for both components and joining layers such as solders, glues thermal epoxies etc. This publication investigates thermo-mechanical stresses in a simplified sandwich assembly by means of FEM simulations. The thermo-mechanical behavior of simplified assemblies with key x-dim components soldered to one and two substrates is evaluated.