High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives
Konferenz: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
16.03.2010 - 18.03.2010 in Nuremberg, Germany
Tagungsband: CIPS 2010
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Delatte, Pierre; Dessard, Vincent; Saib, Aimad; Pequignot, Nicolas; Picún, Gonzalo; Demeûs, Laurent; Doucet, Jean-Christophe; Krebs, Thomas (CISSOID S.A., Rue E. Francqui, 1435 Mont-Saint-Guibert, Belgium)
This paper presents a new high temperature chipset specially designed for high-reliability and high-density DC-DC Converters and Motor Drive applications. Integrated circuits (IC’s) such as Pulse-Width-Modulation (PWM) controllers and half-bridge drivers as well as power n-channel MOSFET’s transistors have been optimized to meet the strong requirements of high temperature harsh environments. Based on this chipset and existing high-temperature circuits, DC-DC converters and high power transistor driver reference designs with reliable operation from -55deg C up to 225deg C have been demonstrated. Future developments are also discussed.