A cost-effective thermal managed high output power VECSEL with hybrid mirror on Copper substrate at 1,55micrometer
Konferenz: IPRM 2011 - 23th International Conference on Indium Phosphide and Related Materials
22.05.2011 - 26.05.2011 in Berlin, Germany
Tagungsband: IPRM 2011
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Zhao, Z.; Ferlazzo, L.; Harmand, J. L.; Oudar, J. L.; Bouchoule, S. (Laboratoire de Photonique et de Nanostructures (LPN), CNRS, Marcoussis, France)
Decobert, J. (Alcatel III-V Lab, Marcoussis, France)
Inhalt:
A 1.55 µm OP-VECSEL with electro-deposited copper substrate was optimized for lasing operation. It is a cost-effective solution compared with CVD diamond substrate assembled by metallic bonding. Experimental results showed that the effective thermal resistance Rth of a 60-µm diameter OP-VECSEL with ~150-µm thick copper substrate was 34±3 K/W. In plane concave cavity, maximum output power of 42,3mW was achieved at 25deg C when a 980nm single mode pump laser with pump power ~450mw was used, showing the potentiality of external cavity semiconductor disk lasers to generate mode-locked pulse train at 1.55 µm when it will be assembled with a fast saturable absorber mirror (SESAM).