Heteroepitaxial bonding of GaInAs quantum wells on Si: a new approach towards photonic integration on Si for devices operating at 1.55micrometer

Konferenz: IPRM 2011 - 23th International Conference on Indium Phosphide and Related Materials
22.05.2011 - 26.05.2011 in Berlin, Germany

Tagungsband: IPRM 2011

Seiten: 3Sprache: EnglischTyp: PDF

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Talneau, A.; Chouteau, D.; Mauguin, O.; Largeau, L.; Sagnes, I.; Patriarche, G. (Laboratoire de Photonique et de Nanostructures, Route de Nozay, 91460 Marcoussis, France)

Heteroepitaxial bonding of III-V materials, mainly InP on Si, without any intermediate dielectric layer, shall allow 1.55micrometer operating devices to be designed including nano-structuration for tailored spectral operation and no thermal limitation of performances. Bonded surfaces should be limited to the areas of active devices only. Preliminary results evidence the successful bonding of InGaAs quantum wells on Si.