Recently updated FIDES 2009 reliability prediction standard compared to FIDES 2004 and others for realistic failure rates of electronic parts required for quantitative Safety Analysis

Konferenz: Zuverlässigkeit und Entwurf - 5. GI/GMM/ITG-Fachtagung
27.09.2011 - 29.09.2011 in Hamburg-Harburg, Deutschland

Tagungsband: Zuverlässigkeit und Entwurf

Seiten: 2Sprache: EnglischTyp: PDF

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Hoppe, Wolfgang (Rheinmetall Technical Publications GmbH, Bremen, Germany)
Hoppe, Martin (Universität Bremen, Bremen, Germany)

The reliability prediction standard FIDES, originated and maintained by the French industry, has been updated by Issue 2009 becoming the most modern standard available. This updated issue is compared to the predecessor FIDES 2004 to reveal the reliability performance of modern complex digital electronic parts being operated in severe use environments. The result is that for those complex digital parts (e. g. FPGAs in 130nm technology) reliability is still increasing between beginning and end of the current decade. Generally the trend is still increasing reliability for all kinds of electronic parts. Exceptions can be traced to modifications in FIDES 2009 models. Comparison to standards MIL-HDBK-217FN2 (mod.), SN29500, 217plus is updated accordingly.