Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results
Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany
Tagungsband: CIPS 2012
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Riedel, G. J.; Schmidt, R.; Liu, C.; Alaperä, I. (ABB Switzerland Ltd., Corporate Research, 5405 Baden-Dättwil, Switzerland)
Beyer, H. (ABB Switzerland Ltd., Semiconductors, 5600 Lenzburg, Switzerland)
Inhalt:
Long term reliability is a key requirement for IGBT modules. Besides wire bond degradation solder degradation is a main mechanism leading to IGBT module failures. A numerical model was developed to describe the solder degradation process. The model includes elastic and (time independent) plastic deformation, as well as primary and secondary creep. To verify the model it was successfully applied to different temperature cycle experiments with SnPb solder as well as SnAgCu solder. It was found that primary creep cannot be neglected for SnAgCu solders.