Micro-fabricated thin-film inductors for on-chip power conversion

Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany

Tagungsband: CIPS 2012

Seiten: 6Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Harburg, Daniel V.; Levey, Christopher G.; Sullivan, Charles R. (Thayer School of Engineering at Dartmouth, Hanover, New Hampshire, USA 03755)
Yu, Xuehong; Herrault, Florian; Allen, Mark G. (School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA 30332)

This paper reports an optimized design and micro-fabrication approach for silicon-integrated elongated-spiral inductors for on-chip power conversion. The inductors are designed for high-power-density and high-efficiency DC-DC converters which transfer 25 W of power at frequencies between 5 and 30 MHz. The predicted power density of the inductors is close to 1 W/mm2 with predicted overall converter efficiencies exceeding 90%. A Co-Zr-O multilayer thin-film magnetic material surrounds the planar copper windings of the inductor within etched silicon trenches. Materials and most processing steps have been experimentally verified. The miniaturization and integration of high-efficiency inductors on silicon can enable radical reductions in the size and cost of power converters for a myriad of applications.