Thermo mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes

Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany

Tagungsband: CIPS 2012

Seiten: 2Sprache: EnglischTyp: PDF

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Sakamoto, Soichi; Suganuma, Katuaki (The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki city, Osaka, Japan)

To develop an ultra-heat-resistant die attach technology at low temperatures, a series of Ag particle-based novel die bonding materials have been proposed. Among these candidates, the thin Ag flake paste has the gretest potential. Thin Ag flakes were mixed with alcohol as a solvent and were formulated into a paste. These Ag pastes were stencil-printed onto Cu substrates with Ag electrolytic coated finishes, and die bonding was carried out. These samples were bonded at a temperature range from 160 °C to 200 °C for 60 min. At 200 °C, stable die bonding was achieved with Micro-thick and Nano-thick Ag-flake paste. In a thermal cycling test, the die bonding samples were exposed to a thermo cycling in temperature range of -40 °C to 250 °C for a holding time of 30 min at each peak temperature.The die bonding with Micro Ag-flake paste exhibits about higher the bonding strength than those with other Ag pastes. The die bonding with Micro Ag-flake paste kept its high strength in thermal cycling.