Reliability of Planar SKiN Interconnect Technology

Konferenz: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
06.03.2012 - 08.03.2012 in Nuremberg, Germany

Tagungsband: CIPS 2012

Seiten: 8Sprache: EnglischTyp: PDF

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Scheuermann, Uwe (SEMIKRON Elektronik GmbH & Co. KG, Nuremberg, Germany)

The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally replaces the interface to the heat sink by an Ag sinter interconnect and thus allows a very compact and light design of power electronic systems.