CVD Diamond-Coated CMP Polishing Pad Conditioner With Asperity Height Variation

Konferenz: ICPT 2012 - International Conference on Planarization / CMP Technology
15.10.2012-17.10.2012 in Grenoble, France

Tagungsband: ICPT 2012

Seiten: 5Sprache: EnglischTyp: PDF

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Choi, Joo Hoon; Lee, Yong Bin; Kim, Byung Ki (R&BD Center at Shinhan Diamond Ind. Co., Ltd, Incheon, Korea)

A novel CVD pad conditioner is fabricated and tested to assess its performance. Thanks to its fabrication method, a controlled three dimensional patterning of asperities that are used to remove glazed CMP polishing pad is realized. The conditioners are fabricated with varying asperity interval and height. The test results confirmed that the CMP performance can be controlled by the CVD conditioner design. In addition, the lifetime of the CVD conditioner is much longer than that of the bulk diamond conditioner. Keywords: Chemical Mechanical Polishing, Pad Conditioner, CVD Diamond