The Synthesis of PS-Si02 Raspberry Structure Nanopartide for CMP Slurry
Konferenz: ICPT 2012 - International Conference on Planarization / CMP Technology
15.10.2012-17.10.2012 in Grenoble, France
Tagungsband: ICPT 2012
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Qin, Hongyi; Kim, Mingu (School of Mechanical Engineering, Sungkyunkwan University, Suwon 440-746, Korea)
Kim, Hojoong; Choi, Hoomi (Sunykyunkwan Advanced Institute of Nano Technology (SAINT), Sungkyunkwan University, Suwon 440-746, Korea)
Kim, Taesung (School of Mechanical Engineering, Sungkyunkwan University, Suwon 440-746, Korea )
Inhalt:
The properties of slurry particles are important factor on the polished surface quality in the CMP process. The composite abrasive is an interesting field in the CMP slurry study. And in this paper, we describe a method to synthesize raspberry structure PS-SiO2 composite nanoparticles and prepare the slurry for the wafer polishing. This novel composite abrasive can reduce the roughness and defects by the polishing experiment. Its removal rate is comparable to the commercial SiO2 slurry. The cushioning effect of soft PS core can decrease the excessive mechanical damage caused by hard silica abrasive. Keywords: Polystyrene SiO2 nanoparticle, Raspberry structure, CMP slurry