Biomaterials Applications of Chemical Mechanical Polishing
Konferenz: ICPT 2012 - International Conference on Planarization / CMP Technology
15.10.2012-17.10.2012 in Grenoble, France
Tagungsband: ICPT 2012
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Basim, G. Bahar; Ozdemir, Zeynep (Ozyegin University, Department of Mechanical Engineering, Nisantepe Mevki, Orman Sokak, No 13, Alemdag, Cekmekoy, 34794, Istanbul, Turkey)
Mutlu, Ozal (Marmara University, Department of Biology, Faculty of Arts and Sciences, Goztepe Campus, Kadikoy, 34722, Istanbul, Turkey)
Inhalt:
Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.